@ ALTECS
  yJISSOzTEG ƒ\ƒŠƒ…[ƒVƒ‡ƒ“ƒvƒƒoƒCƒ_[
@
Дޮ‰ïŽÐƒAƒ‹ƒeƒNƒX 03-3361-2642
@ »•iЉî @ @ @
@
@
menu
@
‰ïŽÐŠT—v
@
»•iЉî
@
@ “dŽq‰ž—pƒVƒXƒeƒ€
@
@ TEG
@
@
‚¨–⇂¹
@
ƒz[ƒ€
@
TEG Line-Up
@
TEG Name Wafer Size [inch] Chip Size [mm] pad Pitch [ƒÊm] Wire Bonding Bumping Process Npte
Screen C4 Ball Mount Au Plating Au Stud Bump Copper Plating
NewATS-TEG01A ƒÓ8  10.0 150 - - - - - - FlipChip
JTEG Phase0 ƒÓ6  2.13 130 - - - - WireBonding /FlipChip
JTEG Phase0H-2 ƒÓ6  2.13 130 - - - - - - Mems
JTEG Phase1E50 ƒÓ8  9.60 500 - - - - - - FlipChip
JTEG Phase1E28 ƒÓ8  9.60 280 - - - FlipChip
JTEG Phase1E15 ƒÓ8  9.60 150 - - - FlipChip
JTEG Phase2E20 ƒÓ8  5.02 200 - - - - FlipChip
JTEG Phase2E175 ƒÓ8  5.02 175 - - - - - FlipChip
JTEG Phase2E150 ƒÓ8  5.02 150 - - - - - - FlipChip
JTEG Phase2E125 ƒÓ8  5.02 125 - - - - - - FlipChip
JTEG Phase3 ƒÓ8  9.60 60/55/50/45/40/35/30 - - - - - - WireBonding
JTEG Phase4 ƒÓ6  2.11 60/50/45 - - - - WireBonding /FlipChip
JTEG Phase5 ƒÓ6  3.00 300 - - - - - - WireBonding
JTEG Phase5GB2 ƒÓ6  3.00 30 - - - - - - FlipChip
JTEG Phase6_60 ƒÓ6 16.0*1.8 60/80/100 - - - - - - FlipChip(LCD Type)
JTEG Phase6_50 ƒÓ6 15.1*1.6 50 - - - - - - FlipChip(LCD Type)
JTEG Phase6_40 ƒÓ6 20.1*1.1 40 - - - - - - FlipChip(LCD Type)
JTEG Phase6_35 ƒÓ6 15.1*1.6 35 - - - - - - FlipChip(LCD Type)
JTEG Phase6_30 ƒÓ6 15.1*1.6 30 - - - - - - FlipChip(LCD Type)
JTEG Phase6_25 ƒÓ6 15.1*1.6 25 - - - - - - FlipChip(LCD Type)
JTEG Phase6_25E ƒÓ8 20.0*3.0 25 - - - - - - FlipChip(LCD Type)
JTEG Phase6_20 ƒÓ8 15.1*1.6 20 - - - - - - FlipChip(LCD Type)
JTEG Phase6_15S ƒÓ6 15.1*1.6 30 - - - - - - FlipChip(LCD Type)
JTEG Phase7 ƒÓ6  0.55 150 - - - - WireBonding /FlipChip
JTEG Phase8 ƒÓ8  3.50 120 - - - - - WireBonding /FlipChip
JTEG Phase9_Cu ƒÓ8  5.09 150 - - - - - - FlipChip
JTEG Phase10_200 ƒÓ8  5.02 200 - - - - - - FlipChip(Low-K)
JTEG Phase11_80 ƒÓ8  7.30 80 - - - - WireBonding /FlipChip
JTEG Phase11_70 ƒÓ8  7.30 70 - - - - WireBonding /FlipChip
JTEG Phase11_60 ƒÓ8  7.30 60 - - - - WireBonding /FlipChip
JTEG Phase11_50 ƒÓ8  7.30 50 - - - - WireBonding /FlipChip
JTEG Phase11_40 ƒÓ8  7.30 40 - - - - WireBonding /FlipChip
JTEG Phase12 ƒÓ8 6.0*2.3 300 - - - - - - Migration
JTEG Phase13 ƒÓ8  5.02 200 - - - - - - Glass Chip
JTEG Phase14 ƒÓ8 6.0*2.3 300 - - - - - - FlipChip(WL-CSP Type)
JTEG Phase15 ƒÓ8  15.0 200 - - - - - - FlipChip
JTEG Phase16 ƒÓ8  0.9 70/85 - - - - - - WireBonding
@
@ @ @
Copyright (C) 2006 ALTECS CO.,LTD.. All rights reserved